1. Yu-Jen Fan, SEMATECH Inc. (United States); Ken Maruyama, Ramakrishnan Ayothi, Takehiko Naruoka, JSR Micro, Inc. (United States); Tonmoy Chakraborty, Dominic Ashworth, SEMATECH Inc. (United States); Jun Sung Chun, SEMATECH/CNSE (United States); Cecilia A. Montgomery, Shih-Hui Jen, Mark Neisser, Kevin D. Cummings, SEMATECH Inc. (United States) “First results of outgas resist family test and correlation between outgas specifications and EUV resist development” SPIE 2015 (9422-36)
2. High speed EUV using post processing and self-aligned double patterning as a speed enhancement technique;Wandell,2014
3. Jun Sung Chun, Shiu-Hui Jen, Karen Petrillo, Dominic Ashworth, Mark Neisser, Takashi Saito, Lior Huli, Metz Andrew, “Enabling robust EUV lithography for NXE3300 applications : 2013 SEMATECH’s Cycles Of Learning Project Combined with TEL” EUV Symposium, Toyama, Japan October 2013
4. Resist process applications to improve EUV patterning;Petrillo,2013
5. Assessment of EUV Resist Performance f or sub-22nm HP lines and 26nm contacts on NXE3100;Goethals,2012