Digital twin technology introduction to increase yield of processes-Reference-Cited by-同舟云学术

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Digital twin technology introduction to increase yield of processes

Published:2024-04-10 Issue: Volume:11 Page:36
ISSN:
Container-title:DTCO and Computational Patterning III
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Author:

Grould Marion,Baderot Julien,Sanou Isaac Wilfried,Martinez Sergio,Foucher Johann

Publisher

SPIE

Reference10 articles.

1. Strategies to lead in the semiconductor world;Burkacky,2022

2. Simulation-based evaluation of lot release policies in a power semiconductor facility–a case study;Allgeier,2020

3. Etch selectivity during plasma-assisted etching of SiO2 and SiNx: Transitioning from reactive ion etching to atomic layer etching

4. Highly selective Si3N4/SiO2etching using an NF3/N2/O2/H2remote plasma. I. Plasma source and critical fluxes

5. Predictive Maintenance and Intelligent Sensors in Smart Factory: Review

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