SEM defect review and classification for semiconductor device manufacturing
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SPIE
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Correlations between reverse bias leakage current, cathodoluminescence intensity and carbon vacancy observed in 4H-SiC junction barrier Schottky diode;Semiconductor Science and Technology;2023-10-10
2. Wafer Eccentricity Deviation Measurement Method Based on Line-Scanning Chromatic Confocal 3D Profiler;Photonics;2023-04-03
3. Detection of reagent residue on unpolished wafer surface using spot scanning surface inspection system;Thirteenth International Conference on Information Optics and Photonics (CIOP 2022);2022-12-15
4. Productivity and yield improvement through implementation of automated defect review SEM at 45° column tilt in a high-capacity production Fab;Metrology, Inspection, and Process Control for Microlithography XVIII;2004-05-24
5. Wafer Defect Detection Using Directional Morphological Gradient Techniques;EURASIP Journal on Advances in Signal Processing;2002-07-24
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