1. A kinematic analysis of disk motion in a double sided polisher for chemical mechanical planarization (CMP)
2. Technique of double-sided polishing based on ring-pendulum polishing;He;Infrared and Laser Engineering,2011
3. Effect of Pressure on Surface Morphology of 300 mm Silicon Wafers during Double-Side Polishing;Ku;Chinese Journal of Rare Metals,2006
4. Numerical simulation of pressure distribution of flow field in the technology of double-sided polishing;Wei;Chinese Journal of Applied Mechanics,2010