Photonic wire bonding via two-photon polymerization laser lithography for hybrid integration-Reference-Cited by-同舟云学术

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Photonic wire bonding via two-photon polymerization laser lithography for hybrid integration

Published:2023-03-17 Issue: Volume: Page:
ISSN:
Container-title:Integrated Optics: Devices, Materials, and Technologies XXVII
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Author:

Rosborough Victoria,Grant Hannah,Musolf Juergen,Garrett Henry,MacFarlane Jessica,Wagner Sabrina,Shimamura Amalu,Morrison Gordon,Johansson Leif

Publisher

SPIE

Reference5 articles.

1. Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

2. Sub-kHz linewidth external cavity laser (ECL) with Si3N4 resonator used as a tunable pump for a Kerr frequency comb;Maier,2022

3. Photonic Wire Bonding for Silicon Photonics III-V Laser Integration

4. Packaging and interconnect considerations in neuromorphic photonic accelerators;Nezami;IEEE Journal of Select Topics in Quantum Electronics,2023

5. High-power, high temperature O-band DFBs and SOAs for integrated photonic applications;Grant,2022

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultra Wideband Dual-Output Thin Film Lithium Niobate Intensity Modulator;IEEE Journal of Selected Topics in Quantum Electronics;2024-07

2. Enabling space-qualified opto-electronic systems through photonic wirebonding;Sensors and Systems for Space Applications XVII;2024-06-06

3. Photonic Integration Advancements in Miniaturizing High Reliability LIDAR System Components;Springer Aerospace Technology;2024

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