Photonic Wire Bonding for Silicon Photonics III-V Laser Integration
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9673705/9673807/09673842.pdf?arnumber=9673842
Reference5 articles.
1. Hybrid multi-chip assembly of optical communication engines by in situ 3D nano-lithography
2. Photonic wire bonding: a novel concept for chip-scale interconnects
3. Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements
4. III–V lasers selectively grown on (001) silicon
5. Flip-chip assembly of VCSELs to silicon grating couplers via laser fabricated SU8 prisms
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1. Semiconductor optical amplifier (SOA) integrated on a silicon photonic chip using photonic wire bonds (PWBs);Integrated Optics: Devices, Materials, and Technologies XXVIII;2024-03-12
2. On-chip hybrid integration of swept frequency distributed-feedback laser with silicon photonic circuits using photonic wire bonding;Optics Express;2024-01-16
3. Integrated photonics beyond communications;Applied Physics Letters;2023-12-04
4. Fully Integrated Photonic Tensor Core for Neural Network Applications;2023 IEEE Photonics Conference (IPC);2023-11-12
5. Plug‐and‐Play Fiber‐Coupled Quantum Dot Single‐Photon Source via Photonic Wire Bonding;Advanced Quantum Technologies;2023-11-02
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