Materials for single-etch double patterning process: surface curing agent and thermal cure resist-Reference-Cited by-同舟云学术

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Materials for single-etch double patterning process: surface curing agent and thermal cure resist

Published:2009-03-13 Issue: Volume: Page:
ISSN:0277-786X
Container-title:Advances in Resist Materials and Processing Technology XXVI
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Author:

Bae Young C.,Liu Yi,Cardolaccia Thomas,McDermott John C.,Trefonas Peter,Spizuoco Ken,Reilly Michael,Pikon Amandine,Joesten Lori,Zhang Gary G.,Barclay George G.,Simon Julia,Gaurigan Stéphanie

Publisher

SPIE

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Process Variability—Technological Challenge and Design Issue for Nanoscale Devices;Micromachines;2018-12-23

2. Optical and EUV projection lithography: A computational view;Microelectronic Engineering;2015-01

3. Behavior of Lamellar Forming Block Copolymers under Nanoconfinement: Implications for Topography Directed Self-Assembly of Sub-10 nm Structures;Macromolecules;2013-12-26

4. Sensitivity of Process Parameters on Pattern Formation of Litho–Cure–Litho–Etch Process;Japanese Journal of Applied Physics;2012-06-20

5. Sensitivity of Process Parameters on Pattern Formation of Litho–Cure–Litho–Etch Process;Japanese Journal of Applied Physics;2012-06-01

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