The electromigration short‐length effect in Ti‐AlCu‐Ti metallization with tungsten studs
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.360749
Reference21 articles.
1. Current-induced marker motion in gold wires
2. Electromigration in thin aluminum films on titanium nitride
3. Electromigration threshold in aluminum films
4. Evidence of The Electromigration Short-Length Effect in Aluminum-Based Metallurgy With Tungsten Diffusion Barriers
5. Electromigration failure modes in aluminum metallization for semiconductor devices
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