Author:
Somani Nalin,Gautam Yash Kumar,Sharma Sunil Kumar,Kumar Monu
Reference9 articles.
1. The microstructure and the thermal expansion characteristics of Cu/SiCp composites
2. J. Zhu, L Liu, H Z hao, B Shen, and W Hu, “Microstructure and performance of electroformed Cu/na no - SiC composite,” Mater Des, vol. 28, pp. 195 8–62, 2007.
3. The effect of interfacial modifying on the mechanical and wear properties of SiCp/Cu composites
4. G.C. Efe, I Altinsoy, M Ipek, S Zeytin, and C Bindal, “Some properties of Cu–SiC composites produce d by powder metallurgy method,” Mater Met Mater, vol. 49, pp. 131–136, 2011.
5. M. Shabani, M. Hossein Paydar, R. Zamiri, M. Goodarzi, and M. Moshksara, “Microstructural and sliding wear behavior of SiC-particle reinforced copper matrix composites fabricated by sintering and sinter-forging processes,” JMRTEC, vv. 158, 2015.
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