Two-dimensional dopant concentration profiles from ultrashallow junction metal-oxide-semiconductor field-effect transistors using the etch/transmission electron microscopy method

Author:

Yoo K. D.,Marsh C. D.,Booker G. R.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Advance static random access memory soft fail analysis using nanoprobing and junction delineation transmission electron microscopy;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2007

2. A Study on Lateral Distribution of Implanted Ions in Silicon;Transactions on Electrical and Electronic Materials;2006-08-01

3. Post-annealing sequence effects on the characteristics of 20keV BF2 ion implantation at various ion fluences;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2006-01

4. Study of two-dimensional B doping profile in Si fin field-effect transistor structures by high angle annular dark field in scanning transmission electron microscopy mode;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2006

5. Implantation and post-annealing characteristics when impinging small Bn clusters into silicon at low fluence;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2005-01

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