Two-dimensional dopant concentration profiles from ultrashallow junction metal-oxide-semiconductor field-effect transistors using the etch/transmission electron microscopy method
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1469652
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1. Status and review of two-dimensional carrier and dopant profiling using scanning probe microscopy
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3. Physical characterization of two-dimensional doping profiles for process modeling
4. Mapping two-dimensional arsenic distributions in silicon using dopant-selective chemical etching technique
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1. Advance static random access memory soft fail analysis using nanoprobing and junction delineation transmission electron microscopy;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2007
2. A Study on Lateral Distribution of Implanted Ions in Silicon;Transactions on Electrical and Electronic Materials;2006-08-01
3. Post-annealing sequence effects on the characteristics of 20keV BF2 ion implantation at various ion fluences;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2006-01
4. Study of two-dimensional B doping profile in Si fin field-effect transistor structures by high angle annular dark field in scanning transmission electron microscopy mode;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2006
5. Implantation and post-annealing characteristics when impinging small Bn clusters into silicon at low fluence;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;2005-01
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