In situ strain profiling of elastoplastic bending in Ti–6Al–4V alloy by synchrotron energy dispersive x-ray diffraction
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3122029
Reference21 articles.
1. Strain field and scattered intensity profiling with energy dispersive x-ray scattering
2. Strain profiling of fatigue crack overload effects using energy dispersive X-ray diffraction
3. Fatigue history and in-situ loading studies of the overload effect using high resolution X-ray strain profiling
4. Stress Gradient Induced Strain Localization in Metals: High Resolution Strain Cross Sectioning via Synchrotron X-Ray Diffraction
5. High-resolution strain mapping in bulk samples using full-profile analysis of energy-dispersive synchrotron X-ray diffraction data
Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A New Residual Strain Mapping Program Using Energy Dispersive X-Ray Diffraction at the Advanced Photon Source;Experimental Mechanics;2022-06-23
2. Energy dispersive X-ray diffraction (EDXRD) for operando materials characterization within batteries;Physical Chemistry Chemical Physics;2020
3. Temporally and Spatially Resolved Visualization of Electrochemical Conversion: Monitoring Phase Distribution During Lithiation of Magnetite (Fe3O4) Electrodes;ACS Applied Energy Materials;2019-03-06
4. Electrochemically Induced Phase Evolution of Lithium Vanadium Oxide: Complementary Insights Gained via Ex-Situ, In-Situ, and Operando Experiments and Density Functional Theory;MRS Advances;2018-03-08
5. Sound velocity during solidification in binary eutectic systems;Journal of Applied Physics;2017-12-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3