Electron microscopy studies of ion implanted silicon for seeding electroless copper films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.367425
Reference7 articles.
1. On the Texture of Electroless Copper Films
2. The Effect of Grain Size on Ductility and Impurity Content of Electroless Copper Deposits
3. Selective electroless copper plating on silicon seeded by copper ion implantation
4. A novel technique for fabrication of metallic structures on polyimide by selective electroless copper plating using ion implantation
5. Selective seeding of copper films on polyimide-patterned silicon substrate, using ion implantation
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Growth of Silica Nanowires;Encyclopedia of Nanotechnology;2016
2. Influence of defects and displacements in sapphire doped with Ag+ ions;Applied Surface Science;2015-12
3. Superconformal filling of 41nm trenches with Cu electroless deposition on Au-activated self-assembled monolayer;Materials Chemistry and Physics;2010-10
4. Electroless Deposition: Theory and Applications;Modern Aspects of Electrochemistry;2010
5. Ion implantation based selective synthesis of silica nanowires on silicon wafers;Applied Physics Letters;2006-04-03
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3