A novel technique for fabrication of metallic structures on polyimide by selective electroless copper plating using ion implantation-Reference-Cited by-同舟云学术

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A novel technique for fabrication of metallic structures on polyimide by selective electroless copper plating using ion implantation

Published:1995-12 Issue:1-2 Volume:270 Page:489-492
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Bhansali S.,Sood D.K.

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Proc. 7th International Conference on Sensors and Actuators;Allen,1993

2. Selective electroless copper plating on silicon seeded by copper ion implantation

3. Metal vapor vacuum arc ion implantation for seeding of electroless Cu plating

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4. TG-FTIR coupled analysis to predetermine effective precursors for laser-activated and electroless metallized materials;Journal of Thermal Analysis and Calorimetry;2019-11-21

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