Hybrid material integration for active photonic applications

Author:

Chen Chengyu12ORCID,Chen Yuping123ORCID,Fang Zhifan12ORCID,Ge Rui12ORCID,Wu Jiangwei12ORCID,Chen Xianfeng124ORCID

Affiliation:

1. State Key Laboratory on Advanced Optical Communication Systems and Networks, Department of Physics and Astronomy, Shanghai Jiao Tong University 1 , 200240 Shanghai, China

2. Department of Physics and Astronomy, Shanghai Jiao Tong University 2 , 200240 Shanghai, China

3. School of Physics, Ningxia University 3 , 217 North Wencui Street, Xixia District, Yinchuan 750021, China

4. Shandong Provincial Engineering and Technical Center of Light Manipulations, Shangdong Normal University 4 , 250358 Jinan, Shandong, China

Abstract

The huge development of micro-/nano-manufacturing techniques on different materials has greatly expanded the possibilities of realizing on-chip multifunctional devices on photonic integrated circuits. In recent years, we have witnessed technological advancements, such as active photonic applications through hybrid integration. In this Perspective, we first summarize the integrated photonic materials, hybrid integration technologies, and corresponding coupling techniques in hybrid integration and give the technique prospects. We also introduce significant advances in hybrid integration technologies for active photonic applications, such as laser sources, optical frequency combs, and modulators, and give our views that are likely to develop rapidly. Finally, we discuss the challenges in hybrid technologies and photonic applications.

Funder

National Natural Science Foundation of China

National Key Research and Development Program of China

Shanghai Jiao Tong University

Publisher

AIP Publishing

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