Plasma energy and work function of conducting transition metal nitrides for electronic applications
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3119694
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1. Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization
2. The electrical property of plasma-treated Ta/TaNx diffusion barrier
3. Effectiveness of reactive sputter-deposited Ta–N films as diffusion barriers for Ag metallization
4. Organometallic vapor phase epitaxial growth of GaN on ZrN∕AlN∕Si substrates
5. The Microstructure of Ti/Al and TiN Ohmic Contacts to Gallium Nitride
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