Vertical GaN trench MOSFETs with step-graded channel doping
Author:
Affiliation:
1. Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, China
2. Microelectronic Thrust, Hong Kong University of Science and Technology (GZ), Guangzhou, China
Abstract
Funder
Research Grants Council, University Grants Committee
Innovation and Technology Fund
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
https://aip.scitation.org/doi/pdf/10.1063/5.0088251
Reference30 articles.
1. GaN-based power devices: Physics, reliability, and perspectives
2. Characterization of 880 V Normally Off GaN MOSHEMT on Silicon Substrate Fabricated With a Plasma-Free, Self-Terminated Gate Recess Process
3. Breakdown Enhancement and Current Collapse Suppression by High-Resistivity GaN Cap Layer in Normally-Off AlGaN/GaN HEMTs
4. Enhancement-Mode GaN MOS-HEMTs With Recess-Free Barrier Engineering and High- ${k}$ ZrO2 Gate Dielectric
5. 1.8 mΩ·cm2vertical GaN-based trench metal–oxide–semiconductor field-effect transistors on a free-standing GaN substrate for 1.2-kV-class operation
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1. Dynamic Reliability Assessment of Vertical GaN Trench MOSFETs With Thick Bottom Dielectric;IEEE Transactions on Device and Materials Reliability;2024-09
2. Special topic on Wide- and ultrawide-bandgap electronic semiconductor devices;Applied Physics Letters;2024-08-12
3. Influence of Doping Engineering in 1 μm Drift Layer Quasi‐Vertical Fin Field‐Effect Transistor for Achieving >139 V Breakdown Voltage;physica status solidi (a);2024-07-25
4. Step Graded Floating Island Embedded Drift Design Engineering for High-Performance Vertical Power Devices;IEEE Transactions on Electron Devices;2023-12
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