C54‐TiSi2formed by direct high current Ti‐ion implantation
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.109417
Reference9 articles.
1. Induced interface interactions in Ti/Si systems by ion implantation
2. Observations on the hexagonal form of MoSi2and WSi2films produced by ion implantation and on related snowplow effects
3. Development of the self-aligned titanium silicide process for VLSI applications
4. High current ion source
5. Metastable phase formation in titanium‐silicon thin films
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2. INTERESTING RESISTIVITY BEHAVIOR OF THE Ag–Ni–Si SILICIDE FILMS FORMED AT 850°C BY RAPID THERMAL ANNEALING OF THE Ag–Ni/Si FILMS;International Journal of Modern Physics B;2011-11-10
3. Structural and electrical characterization of the nickel silicide films formed at 850°C by rapid thermal annealing of the Ni/Si(100) films;Applied Surface Science;2010-06
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5. Structural characteristics and mechanical properties of Ti(Cr) films produced on Si substrate;Thin Solid Films;2009-08
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