Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2185467
Reference14 articles.
1. Chemical Free Room Temperature Wafer To Wafer Direct Bonding
2. Wafer-to-wafer fusion bonding of oxidized silicon to silicon at low temperatures
3. Self‐propagating room‐temperature silicon wafer bonding in ultrahigh vacuum
4. Effect of Surface Roughness on Room-Temperature Wafer Bonding by Ar Beam Surface Activation
5. Influence of applied load on vacuum wafer bonding at low temperature
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