Explosive breakup and evolution of the thermal boundary layer around a pulse-heated microwire in sub- and supercritical CO2

Author:

Wang Gaoyuan1,Hu Zhan-Chao1ORCID

Affiliation:

1. School of Aeronautics and Astronautics, Sun Yat-sen University, No. 66 Gongchang Road, Guangming District, Shenzhen 518107, People's Republic of China

Abstract

This paper reports our experimental findings aimed to understand the importance of compressibility in fluid flow and heat transfer. A platinum microwire of diameter 50 [Formula: see text] was immersed in a pressure vessel filled with [Formula: see text] at different thermodynamic states around the critical point. The microwire was heated by an electric pulse resulting in a temperature rise of about 667 K during 0.35 ms. The snapshots of [Formula: see text] and the temporal profiles of mean temperature of the microwire were recorded. An explosive breakup of the thermal boundary layer is identified, manifested by a radial spreading fluid layer with a “fluffy” boundary. Since buoyancy can only drive upward motions, such a phenomenon is closely related to compressibility, as a result of complex interactions between thermoacoustic waves and large-density-gradient interfaces. This phenomenon is also responsible for the efficient cooling observed in the first 10 ms because expansion is a cooling process and can also help to evacuate high-temperature fluid. Afterward, the flow exhibits various buoyancy-driven patterns depending on the existence and intensity of surface tension: garland-like cluster, unstable gas column, or normal bubble, followed by a continuously thinning thermal boundary layer. Both the classic and the newly revised thermodynamic phase diagrams are employed and compared in this paper, suggesting the latter is proper and informative.

Funder

National Natural Science Foundation of China

Basic and Applied Basic Research Foundation of Guangdong Province

Publisher

AIP Publishing

Subject

Condensed Matter Physics,Fluid Flow and Transfer Processes,Mechanics of Materials,Computational Mechanics,Mechanical Engineering

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