Particle modelling of magnetically confined oxygen plasma in low pressure radio frequency discharge
Author:
Publisher
AIP Publishing
Subject
Condensed Matter Physics
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4907178
Reference25 articles.
1. High-Density 3-D Capacitors for Power Systems On-Chip: Evaluation of a Technology Based on Silicon Submicrometer Pore Arrays Formed by Electrochemical Etching
2. Integrated LC Filter on Silicon for DC–DC Converter Applications
3. Nanocrystallized tetragonal metastable ZrO2 thin films deposited by metal-organic chemical vapor deposition for 3D capacitors
4. Ultrahigh-power micrometre-sized supercapacitors based on onion-like carbon
5. Electron energy distributions in a magnetized inductively coupled plasma
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