Effect of bake/cure temperature of an advanced organic ultra low-k material on the interface adhesion strength to metal barriers-Reference-Cited by-同舟云学术

Effect of bake/cure temperature of an advanced organic ultra low-k material on the interface adhesion strength to metal barriers

Published:2011-04 Issue:7 Volume:109 Page:074301
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Vanstreels Kris,Pantouvaki Marianna,Ferchichi Abdelkarim,Verdonck Patrick,Conard Thierry,Ono Yukiharu,Matsutani Mihoko,Nakatani Koji,Baklanov Mikhail R.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.3561434

Reference13 articles.

1. Low dielectric constant materials for microelectronics

2. Determination of pore size distribution in thin films by ellipsometric porosimetry

3. A. K. Ferchichi, Y. Travaly, L. Carbonell, K. Vanstreels, G. Beyer, M. R. Baklanov, S. Asakuma, and M. Nakajima, in Proceedings of the Advanced Metallization Conference, edited by M. Naik, R. Shaviv, T. Yoda, and K. Ueno(MRS, Warrendale, 2008), p. 587.

4. The mechanism of low-k SiOCH film modification by oxygen atoms

5. Adhesion and debonding of multi-layer thin film structures

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Simultaneous Determination of Young's Modulus and Density of Ultrathin Low‐k Films Using Surface Acoustic Waves;physica status solidi (a);2024-02-20

2. Nondestructive Determination of Young's Modulus of Interconnecting Thin Films by a Broadband Surface Acoustic Wave‐Interdigital Transducer;physica status solidi (RRL) – Rapid Research Letters;2023-01-18

3. ALD Mo for Advanced MOL Local Interconnects;2022 IEEE International Interconnect Technology Conference (IITC);2022-06-27

4. Quantitative Simultaneous Determination for Young’s Modulus and Adhesion of Low-k Thin Film by Non-destructive CZM-SAW Technique;Journal of Nondestructive Evaluation;2019-05-17

5. Evaluation and criterion determination of the low- k thin film adhesion by the surface acoustic waves with cohesive zone model;Applied Surface Science;2017-03