An optimal quasisuperlattice design to further improve thermal stability of tantalum nitride diffusion barriers
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.126509
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3. Diffusion barrier property of TaN between Si and Cu
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5. Properties of TaNx films as diffusion barriers in the thermally stable Cu/Si contact systems
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