Molecular dynamic simulation of tool groove wear in nanoscale cutting of silicon-Reference-Cited by-同舟云学术

Molecular dynamic simulation of tool groove wear in nanoscale cutting of silicon

Author:

Liu Changlin¹^ORCID,Chen Xiao¹^ORCID,Zhang Jianguo¹,Zhang Junjie²,Chu Jianning¹,Xiao Junfeng¹^ORCID,Xu Jianfeng¹

Affiliation:

1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Luoyu Road No. 1037, Wuhan, Hubei 430074, China

2. Center for Precision Engineering, Harbin Institute of Technology, P.O. Box 413, Harbin, Heilongjiang 150001, China

Funder

Open research Foundation of State Key Laboratory of Digital Manufacturing Equipment and Technology in Huazhong University of Science and Technology

National Natural Science Foundation of China

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

Reference49 articles.

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