Contactless pick-and-place of millimetric objects using inverted near-field acoustic levitation-Reference-Cited by-同舟云学术

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Contactless pick-and-place of millimetric objects using inverted near-field acoustic levitation

Published:2020-02-03 Issue:5 Volume:116 Page:054104
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Andrade Marco A. B.¹^ORCID,Ramos Tiago S.²,Adamowski Julio C.³,Marzo Asier⁴^ORCID

Affiliation:

1. Instituto de Física, Universidade de São Paulo, São Paulo 05508-090, Brazil

2. Physics Department, University of Massachusetts, Amherst, Massachusetts 01003, USA

3. Escola Politécnica, Universidade de São Paulo, São Paulo 05508-030, Brazil

4. UpnaLab, Universidad Pública de Navarra, Pamplona 31006, Navarra, Spain

Funder

Fundação de Amparo à Pesquisa do Estado de São Paulo

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5138598

Reference36 articles.

1. Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review

2. Micromachined end-effector and techniques for directed MEMS assembly

3. R. S. Fearing , in Proceedings of IEEE/RSJ International Conference on Intelligent Robots and Systems (1995), pp. 212–217.

4. Non-contact handling in microassembly: Acoustical levitation

5. Analysis of a method for magnetic levitation

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