Elastic constants and thermal expansion coefficient of metastable C49 TiSi2
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.353058
Reference16 articles.
1. Development of the Self-Aligned Titanium Silicide Process for VLSI Applications
2. Metastable phase formation in titanium‐silicon thin films
3. Metallurgical topics in silicon device interconnections: Thin film stresses
4. Effects of stress in TiSi2gate metal‐oxide‐silicon structures
5. Elastic stiffness and thermal expansion coefficients of various refractory silicides and silicon nitride films
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