1. K.-N. Tu
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Fundamentals of Electromigration,” in Solder Joint Technology: Materials, Properties, and Reliability (
Springer,
New York, NY, 2007), pp. 211–243.
2. Visualizing the Electron Scattering Force in Nanostructures
3. Current-Induced Stabilization of Surface Morphology in Stressed Solids
4. Nonlinear Wavelength Selection in Surface Faceting under Electromigration
5. K.-N. Tu
, “
Thermomigration,” in Solder Joint Technology: Materials, Properties, and Reliability (
Springer,
New York, NY, 2007), pp. 327–346.