Decomposition and nanocrystallization in reactively sputtered amorphous Ta–Si–N thin films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1388173
Reference21 articles.
1. Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures
2. Barriers For Copper Interconnections
3. Phase formation behavior and diffusion barrier property of reactively sputtered tantalum-based thin films used in semiconductor metallization
4. Interdiffusions in Cu/reactive‐ion‐sputtered TiN, Cu/chemical‐vapor‐deposited TiN, Cu/TaN, and TaN/Cu/TaN thin‐film structures: Low temperature diffusion analyses
5. Dense fully 111-textured TiN diffusion barriers: Enhanced lifetime through microstructure control during layer growth
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