Lattice degradation by moving voids during reversible electromigration
Author:
Affiliation:
1. Faculty of Physics and Center for Nanointegration Duisburg-Essen (CENIDE), University of Duisburg-Essen, D-47057 Duisburg, Germany
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4889816
Reference29 articles.
1. Electromigration and crevice formation in thin metallic films
2. Metal electromigration damage healing under bidirectional current stress
3. Repair of Electromigration-Induced Voids in Aluminum Interconnection by Current Reversal
4. Electromigration in Gold and Single Crystalline Silver Nanowires
5. Electromigration for microarchitects
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