Thermal-induced bandgap broadening phenomenon in copolymer organic semiconductors

Author:

Chang Hengdian12ORCID,Zhang Jun12ORCID,Wu Xin12,Lin Haonan12ORCID,Mou Yabin12ORCID,Wu Zhiyao12,Zhou Jia3,Qian Haowen3,Yao Jiafei12ORCID,Yang Kemeng12,Chen Jing12,Li Man12,Li Wen3ORCID,Yi Mingdong3ORCID,Bai Song4,Guo Yufeng12

Affiliation:

1. College of Integrated Circuit Science and Engineering, National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications 1 , No. 9 Wenyuan Rd., Nanjing, China

2. National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications 2 , No. 9 Wenyuan Rd., Nanjing, China

3. Key Laboratory for Organic Electronics and Information Displays, Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications 3 , Nanjing, China

4. Nanjing Electronic Devices Institute, State Key Laboratory of Wide-Bandgap Semiconductor Power Electronic Devices 4 , No. 166 ZhengfangXi Rd., Nanjing, China

Abstract

This study elucidates the thermal-induced bandgap broadening (TBB) phenomenon in copolymer organic semiconductors (OSCs). From the perspective of device physics, the diketopyrrolopyrrole-based copolymer was employed as the semiconductor layer to fabricate a back-to-back Schottky junction structure. Characterization through the analysis of I–V curves enables the qualitative exploration of the correlation between bandgap and temperature in copolymer OSCs. Then, technology computer-aided design was utilized to explore the influence of thermal-induced bandgap broadening on the back-to-back Schottky I–V curves. Subsequently, the variable temperature UV-VIS-NIR absorption spectra of the copolymer OSCs were analyzed, providing quantitative evidence of the thermal-induced bandgap broadening phenomenon and confirming its recoverability. Through the research of the Schottky junction and absorption spectra, we verified the consistency of the TBB phenomenon in both the electrical and optical bandgaps. From the scanning electron microscope images of the copolymer OSC films, it is found that the thermal-induced bandgap broadening phenomenon is mainly caused by thermal expansion and increased disorder of copolymer molecules. This study highlights a physical phenomenon of copolymer OSCs that is different from most inorganic semiconductors, and such insight offers a theoretical perspective for the application and thermal stability investigation of copolymer devices under high temperature conditions.

Funder

National Natural Science Foundation of China

Jiangsu Association for Science and Technology

Natural Science Foundation of Jiangsu Province

Publisher

AIP Publishing

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