Metal contacts and Schottky barrier heights at boron arsenide interfaces: A first-principles study

Author:

Fu Zhiyong1ORCID,Guo Hailing1ORCID,Wang Xiting1,Cao Ruyue2ORCID,Zhong Hongxia3ORCID,Liu Sheng4ORCID,Robertson John12ORCID,Guo Yuzheng1ORCID,Zhang Zhaofu456ORCID

Affiliation:

1. School of Electrical Engineering and Automation, Wuhan University 1 , Wuhan 430072, China

2. Department of Engineering, University of Cambridge 2 , Cambridge CB2 1PZ, United Kingdom

3. School of Mathematics and Physics, China University of Geosciences 3 , Wuhan 430074, China

4. The Institute of Technological Sciences, Wuhan University 4 , Wuhan 430072, China

5. Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration, Wuhan University 5 , Wuhan 430072, China

6. Research Institute of Wuhan University in Shenzhen 6 , Shenzhen 518057, China

Abstract

The combined feature of high thermal conductivity and high carrier mobility makes cubic boron arsenide (c-BAs) promising for high power and high frequency applications. In BAs-based electronics, the interaction between metals and BAs is crucial, as it significantly affects the electronic properties. One particular parameter is the Schottky barrier height (SBH), which plays a critical role in determining the transmission properties. The interfacial contact effects of BAs (110), (111), and (100) surfaces with a variety of metals have been carefully explored using first-principles calculations in order to characterize their electrical characteristics. For p-type SBHs, over different terminations, there is a strong linear trend with increasing metal work function, with a relatively steeper pinning coefficient of ∼0.2. The results show that the SBHs follow a relation of ϕn(110) > ϕn(111) > ϕn(100). Clear metal induced gap states can be observed at the interfacial BAs, resulting in an enhanced Fermi level pinning effect. The Sc is excellent at generating Schottky contacts with relatively higher SBHs (∼0.9 eV). Pt has the smallest barrier height of ∼0.3 eV, making it ideal for ohmic electrodes with low contact resistance. This work provides insight into the properties at metal–BAs contact interfaces and provides a theoretical basis for the selection of suitable electrodes for high power BAs devices.

Funder

Guangdong Basic and Applied Basic Research Foundation

Knowledge Innovation Program of Wuhan-Shuguang Foundation

Open Fund of Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration

Publisher

AIP Publishing

Subject

General Physics and Astronomy

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