First‐Principles Study of Schottky Barrier Heights on Metal/4H‐SiC Polar Interfaces

Author:

Ji Wen12,Tang Xi1ORCID,Cao Ruyue3,Jiang Ming1,Guo Yuzheng4,Zhou Shuxing5ORCID,Hu Cungang1,Zhang Zhaofu267ORCID

Affiliation:

1. Institute of Physical Science and Information Technology Anhui University Hefei 230601 Anhui China

2. The Institute of Technological Sciences Wuhan University Wuhan 430072 Hubei China

3. State Key Laboratory of Superlattices and Microstructures Institute of Semiconductors Chinese Academy of Sciences Beijing 100083 China

4. School of Electrical Engineering and Automation Wuhan University Wuhan 430072 Hubei China

5. Hubei Key Laboratory of Low Dimensional Optoelectronic Materials and Devices Hubei University of Arts and Science Xiangyang 441053 Hubei China

6. Research Institute of Wuhan University in Shenzhen Wuhan University Shenzhen 518057 Guangdong China

7. Hubei Key Laboratory of Electronic Manufacturing and Packaging Integration Wuhan University Wuhan 430072 Hubei China

Abstract

4H‐SiC based devices have garnered significant interest within the realm of high‐voltage and high‐frequency electronic equipment. Schottky barrier heights (SBHs) play a pivotal role in determining the properties of metal/4H‐SiC contacts and holding significance for electrical performance of 4H‐SiC devices. Herein, the first‐principles method is utilized to investigate the interface properties between various metals (Sc, Mg, Zr, Ag, Al, Ru, Rh, Pd, Ni, Au, Ir, and Pt) and 4H‐SiC. The results reveal an approximate linear relationship between SBH and work function of these metals. Fermi‐level pinning factors are determined to be 0.27 and 0.32 for the Si‐face and C‐face interfaces, respectively. The disparity in pinning factors arises from polarization differences between the two interfaces, which stem from uneven net charge distribution on the Si‐face and C‐face. Meanwhile, the SBH values indicate a strong pinning effect, due to the charge transfer occurring at the metal/4H‐SiC interface. Through further analysis of layer density and differential charge density, the interatomic interaction and charge transfer between metal and SiC atoms are analyzed. This work offers fundamental insights into the structural changes in metal/4H‐SiC interfaces and provides valuable guidance in the potential prediction and optimization of device performance.

Funder

Basic and Applied Basic Research Foundation of Guangdong Province

Natural Science Foundation of Anhui Province

Natural Science Foundation of Hubei Province

Publisher

Wiley

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