Effective method for stress reduction in thick porous silicon films
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1465130
Reference13 articles.
1. New silicon‐on‐insulator technology using a two‐step oxidation technique
2. Silicon quantum wire array fabrication by electrochemical and chemical dissolution of wafers
3. Breaking the isotropy of porous silicon formation by means of current focusing
4. A novel capacitor technology based on porous silicon
5. An approach for fabricating high-performance inductors on low-resistivity substrates
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1. RF Electrical Isolation with Porous Silicon;Handbook of Porous Silicon;2018
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3. Depth detection and fabrication of porous silicon without the stress;Applied Surface Science;2016-01
4. Stress control of porous silicon films for microelectromechanical systems;Microporous and Mesoporous Materials;2015-12
5. Evaluation of mesoporous silicon substrates strain for the integration of radio frequency circuits;Thin Solid Films;2015-06
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