Local viscoelasticity at resin-metal interface analyzed with spatial-decomposition formula for relaxation modulus-Reference-Cited by-同舟云学术

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Local viscoelasticity at resin-metal interface analyzed with spatial-decomposition formula for relaxation modulus

Published:2019-09-21 Issue:11 Volume:151 Page:114904
ISSN:0021-9606
Container-title:The Journal of Chemical Physics
language:en
Short-container-title:J. Chem. Phys.

Author:

Mori Hodaka¹²,Matubayasi Nobuyuki²³^ORCID

Affiliation:

1. DENSO Corporation, 1-1, Showa-cho, Kariya, Aichi 448-8661, Japan

2. Division of Chemical Engineering, Graduate School of Engineering Science, Osaka University, Toyonaka, Osaka 560-8531, Japan

3. Elements Strategy Initiative for Catalysts and Batteries, Kyoto University, Katsura, Kyoto 615-8520, Japan

Funder

Japan Society for the Promotion of Science

Ministry of Education, Culture, Sports, Science and Technology

HPCI System Research Project

Publisher

AIP Publishing

Subject

Physical and Theoretical Chemistry,General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5109599

Reference128 articles.

1. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

2. Materials for Advanced Packaging, edited by D. Lu and C. Wong (Springer US, 2009), pp. 339–364.

3. Adhesion and durability of metal-polymer bonds

4. Contact angle, wetting, and adhesion: a critical review

5. Plasma surface modification of polymers for improved adhesion: a critical review

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1. Local viscoelastic properties and shear stress propagation in bulk and confined polymer melts and low-molecular weight liquids;Physical Review Research;2024-05-13

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