Outdiffusion of Cu through Au: Comparison of (100) and (111) Cu films epitaxially deposited on Si, and effects of annealing ambients
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.101944
Reference4 articles.
1. Outdiffusion of Si through gold films: The effects of Si orientation, gold deposition techniques and rates, and annealing ambients
2. Thermal stability of the Cu/PtSi metallurgy
3. Thin-film interactions and their relevance to electronic packaging
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