Effect of layer structure of AlN interlayer on the strain in GaN layers during metal-organic vapor phase epitaxy on Si substrates

Abstract

It is highly challenging to grow high-quality gallium nitride (GaN) layers on silicon (Si) substrates due to the intrinsic mismatching of their structural and thermal properties. Aluminum nitride (AlN) interlayers have been used to induce a compressive strain to GaN layers during growth, which compensates for the tensile strain in these layers on Si substrates during cooling. In this study, we investigated the effect of the growth temperature and layer structure of the AlN interlayer to understand the relationship between surface flatness and relaxation ratio of the AlN interlayer and the compressive strain in the overlying GaN layer. Low-temperature (LT) growth enhanced lattice relaxation of the AlN interlayer, whereas the AlN surface was atomically flat at high temperature (HT). We also examined a two-step growth to combine the advantages of LT- and HT-AlN. This approach resulted in a surface with multiple flat regions separated by grooves, which had the largest compressive strain in the overlying GaN layer at the early stages of growth. At later stages, the strain was the largest on the HT-AlN interlayer. In both cases, the experimentally measured compressive strain exceeded simulated predictions. Finally, possible solutions for inducing a larger compressive strain in the GaN layer using interlayers were discussed.