Progress and challenges on 3D tubular structures and devices of 2D materials

Author:

Wu Binmin12ORCID,Zhang Ziyu1ORCID,Wang Chao1ORCID,Song Enming3,Cui Jizhai14,Huang Gaoshan14ORCID,Zhou Peng2ORCID,Di Zengfeng5ORCID,Mei Yongfeng134ORCID

Affiliation:

1. Department of Materials Science, International Institute of Intelligent Nanorobots and Nanosystems, State Key Laboratory of ASIC and Systems, Fudan University, Shanghai 200433, People's Republic of China

2. School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China

3. Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University, Shanghai 200433, People's Republic of China

4. Yiwu Research Institute of Fudan University, Yiwu, Zhejiang 322000, People's Republic of China

5. State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, People's Republic of China

Abstract

Due to their unique structures and properties, emerging two-dimensional (2D) materials have been at the frontier of research in, e.g., materials science, physics, and engineering. Three-dimensional (3D) tubular geometry enables 2D materials unparalleled advantages for various applications, for example, wide-angle infrared photodetectors, extremely sensitive molecular sensors, and memory with high density. Furthermore, 3D tubular structures offer a promising integration platform into chips with a broad range of materials, especially 2D materials. In this Perspective, we highlight state-of-the-art methods to assemble/manufacture 2D materials into 3D tubular structures/devices via self-rolled-up or template methods. These tubular 3D devices inspire unique physical, chemical, and mechanical properties for optical microcavity, photodetector, on-chip electronics, and bubble-propelled microengines. On-chip manufacture of 3D tubular structures/devices provides great opportunity and challenge for 2D materials for More than Moore applications such as unconventional electronics, smart sensors, and miniaturized robots.

Funder

Key Technologies Research and Development Program

National Natural Science Foundation of China

Science and Technology Commission of Shanghai Municipality

Program of Shanghai Academic Research Leader

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

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