Wafer-scale heterogeneous integration InP on trenched Si with a bubble-free interface

Author:

Lin Jiajie12ORCID,You Tiangui1ORCID,Jin Tingting12,Liang Hao12,Wan Wenjian3,Huang Hao14,Zhou Min1,Mu Fengwen5,Yan Youquan12ORCID,Huang Kai1,Zhao Xiaomeng1ORCID,Zhang Jiaxiang1,Wang Shumin6,Gao Peng7,Ou Xin12ORCID

Affiliation:

1. State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China

2. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China

3. Key Laboratory of Terahertz Solid-State Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, 865 Changning Road, Shanghai 200050, China

4. School of Physical Science and Technology, Shanghai Tech University, Shanghai 201210, China

5. Kagami Memorial Research Institute for Materials Science and Technology, Waseda University, Shinjuku, Tokyo 169-0051, Japan

6. Department of Microtechnology and Nanoscience, Chalmers University of Technology, Gothenburg 41296, Sweden

7. Science and Technology on Power Sources Laboratory, Tianjin Institute of Power Sources, Tianjin 300384, China

Funder

National Key RD Program of China

Frontier Science Key Program of CAS

Chinese Austrian Cooperative RD Project

Shanghai Science and Technology Innovation Action Plan Program

Shanghai Sailing Program

K.C.Wong Education Foundation

Program of Shanghai Academic Research Leader

National Natural Science Foundation of China FundRef identification ID:

Publisher

AIP Publishing

Subject

General Engineering,General Materials Science

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