Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics application on 8″ wafer platform-Reference-Cited by-同舟云学术

Adhesive-free bonding for hetero-integration of InP based coupons micro-transfer printed on SiO2 into Complementary Metal-Oxide-Semiconductor backend for Si photonics application on 8″ wafer platform

Published:2024-06 Issue: Volume:799 Page:140399
ISSN:0040-6090
Container-title:Thin Solid Films
language:en
Short-container-title:Thin Solid Films

Author:

Anand K.^ORCID,Steglich P.^ORCID,Kreissl J.^ORCID,Chavarin C.A.^ORCID,Spirito D.^ORCID,Franck M.^ORCID,Lecci G.^ORCID,Costina I.,Herfurth N.^ORCID,Katzer J.,Mai C.,Becker A.,Reithmaier J.P.,Zimmermann L.^ORCID,Mai A.^ORCID

Funder

BMBF Berlin

FMD

Bundesministerium für Bildung und Forschung

Publisher

Elsevier BV

Reference20 articles.

1. Transfer-printing-based integration of single-mode waveguide-coupled III-V-on-silicon broadband light emitters;Groote;Opt. Express,2016

2. III-V-on-silicon photonic devices for optical communication and sensing;Roelkens;Photonics,2015

3. Heterogeneous integration of III-V materials by direct wafer bonding for high-performance electronics and optoelectronics;Caimi;IEEE Trans. Electron. Dev.,2021

4. Heterogeneously integrated optoelectronic devices enabled by micro-transfer printing;Yoon;Adv. Opt. Mater.,2015

5. Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate;Keyvaninia;Opt. Mater. Express,2013

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1. Scalable transfer printing approach to heterogeneous integration of InP lasers on silicon-on-insulator waveguide platform;Applied Physics Letters;2024-08-19