Thermal transport and grain boundary conductance in ultrananocrystalline diamond thin films-Reference-Cited by-同舟云学术

Thermal transport and grain boundary conductance in ultrananocrystalline diamond thin films

Published:2006-06 Issue:11 Volume:99 Page:114301
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Angadi Maki A.,Watanabe Taku,Bodapati Arun,Xiao Xingcheng,Auciello Orlando,Carlisle John A.,Eastman Jeffrey A.,Keblinski Pawel,Schelling Patrick K.,Phillpot Simon R.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2199974

Reference36 articles.

1. Critical Aspects of High-Performance Microprocessor Packaging

2. NANOCRYSTALLINE DIAMOND FILMS

3. Interpretation of the Raman spectra of ultrananocrystalline diamond

4. Materials science and fabrication processes for a new MEMS technology based on ultrananocrystalline diamond thin films

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