Texture formation in Ag thin films: Effect of W–Ti diffusion barriers
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3028233
Reference27 articles.
1. Stability of silver thin films on various underlying layers at elevated temperatures
2. Scaling properties and electromigration resistance of sputtered Ag metallization lines
3. Diffusion barrier properties of TiW between Si and Cu
4. Al/TixW1−x metal/diffusion-barrier bilayers: Interfacial reaction pathways and kinetics during annealing
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1. Design of diffusion barrier and buffer layers for β-Zn4Sb3 mid-temperature thermoelectric modules;Journal of Alloys and Compounds;2018-09
2. Understanding the diffusion wear mechanisms of WC-10%Co carbide tools during dry machining of titanium alloys;Wear;2017-11
3. Effects of electric field annealing on the interface diffusion of Cu/Ta/Si stacks;Applied Surface Science;2011-07
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