Engineering the mechanical properties of ultrabarrier films grown by atomic layer deposition for the encapsulation of printed electronics-Reference-Cited by-同舟云学术

Engineering the mechanical properties of ultrabarrier films grown by atomic layer deposition for the encapsulation of printed electronics

Published:2015-08-28 Issue:8 Volume:118 Page:085501
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:J. Appl. Phys.

Author:

Bulusu A.¹^ORCID,Singh A.¹,Wang C. Y.²,Dindar A.²,Fuentes-Hernandez C.²,Kim H.¹,Cullen D.³,Kippelen B.²,Graham S.¹³

Affiliation:

1. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, USA

2. School of Electrical and Computer Engineering, Georgia Institute of Technology, and Center for Organic Photonics and Electronics, Atlanta, Georgia 30332, USA

3. Oak Ridge National Laboratory, P.O. Box 2008 MS-6064, Oak Ridge, Tennessee 37831, USA

Funder

U.S. Department of Energy (Department of Energy)

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/am-pdf/10.1063/1.4928855

Reference29 articles.

1. Singlet Oxygen as a Reactive Intermediate in the Photodegradation of an Electroluminescent Polymer

2. Photo‐oxidation of electroluminescent polymers studied by core‐level photoabsorption spectroscopy

3. Stability/degradation of polymer solar cells

4. Reliability and degradation of organic light emitting devices

5. Thin-Film Permeation-Barrier Technology for Flexible Organic Light-Emitting Devices

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