Effects of wafer bow and warpage on the integrity of thin gate oxides
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.111231
Reference6 articles.
1. The Effect of CMOS Processing on Oxygen Precipitation, Wafer Warpage, and Flatness
2. Thermal Wafer Warpage and its Avoidance
3. Stress and Warpage Studies of Silicon Based Plain and Patterned Films During Rapid Thermal Processing (RTP)
4. Rapid isothermal processing
5. Stress‐related problems in silicon technology
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