Thermodynamic understanding of Sn whisker growth on the Cu surface in Cu(top)-Sn(bottom) bilayer system upon room temperature aging-Reference-Cited by-同舟云学术

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Thermodynamic understanding of Sn whisker growth on the Cu surface in Cu(top)-Sn(bottom) bilayer system upon room temperature aging

Published:2015-06-07 Issue:21 Volume:117 Page:215308
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Huang Lin¹,Jian Wei¹,Lin Bing¹,Wen Yuren²³,Gu Lin³,Wang Jiangyong¹

Affiliation:

1. Department of Physics, Shantou University, 243 Daxue Road, Shantou, 515063 Guangdong, China

2. School of Materials Science and Engineering, Nanchang University, Nanchang, 330031 Jiangxi, China

3. Institute of Physics, Chinese Academy of Sciences, 100190 Beijing, China

Funder

National Natural Science Foundation of China (NSFC)

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.4922243

Reference29 articles.

1. Annotated tin whisker bibliography and anthology

2. Template-free electrochemical synthesis of tin nanostructures

3. Tin whiskers studied by synchrotron radiation scanning X-ray micro-diffraction

4. Microscopy Study of Tin Whiskers

5. A model of Sn whisker growth by coupled plastic flow and grain boundary diffusion

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