Dopant diffusion control in silicon using germanium
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.347170
Reference7 articles.
1. Anomalous co‐diffusion effects of germanium on group III and V dopants in silicon
2. Improved MOSFET short-channel device using germanium implantation
3. Suppression of hot-carrier degradation in Si MOSFETs by germanium doping
4. Interstitial Interactions: Arsenic‐Aluminum, Phosphorus‐Aluminum Push Effect
5. Interstitial interactions: Aluminum‐boron, aluminum‐gallium, and boron‐gallium pull effect
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1. Controlling the diffusion of implanted boron in Si and silicide by multiple implants;Materials Chemistry and Physics;1998-07
2. The influence of Ge-implantation on the electrical characteristics of the ultra-shallow junction formed by using silicide as a diffusion source;IEEE Electron Device Letters;1996-03
3. The Si/SiO2 interface trap density in boron/germanium- and phosphorus/germanium-implanted silicon;Applied Surface Science;1994-03
4. Transient boron diffusion in medium dose germanium‐implanted silicon;Journal of Applied Physics;1992-02
5. Residual Damage in Heavily Germanium-Doped Silicon;MRS Proceedings;1992
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