Bonding silicon-on-insulator to glass wafers for integrated bio-electronic circuits-Reference-Cited by-同舟云学术

Bonding silicon-on-insulator to glass wafers for integrated bio-electronic circuits

Published:2004-09-20 Issue:12 Volume:85 Page:2370-2372
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Kim Hyun S.,Blick Robert H.,Kim D. M.,Eom C. B.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.1794855

Reference9 articles.

1. E. Obermeier, Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Science, Technology and Application, 1995, vol. 95-7, p. 212.

2. Wafer-to-wafer bonding for microstructure formation

3. M. Harz and W. Brueckner, Proceedings of the Third International Symposium on Semiconductor Wafer Bonding: Science, Technology and Application, 1995, vol. 95-7, p. 315.

4. Improved direct bonding of Si and SiO2 surfaces by cleaning in H2SO4:H2O2:HF

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