1. Steinberg D S, Yong Chang, etc. Electronic equipment thermal cycling and vibration fault prevention [M]. Aviation Industry Press, 2012. (in Chinese)
2. Steinberg D S. Vibration Analysis of Electronic Equipment (2nd Ed) [M]g. New York: John Wiley&Sons, 1988
3. Xinshi Gu. Copper clad laminate for printed circuit [J]. Print circuit information, 1994(1):36–40. (in Chinese)
4. Maimaitiming Aini. ANSYS Workbench 14.0 Simulation Technology and Engineering Practice [M]. Tsinghua University Press, 2013. (in Chinese)
5. R. W. Little, Master’s Thesis, University of Wisconsin, 1959.