Stress relaxation of AlGaN on nonpolar m-plane GaN substrate

Author:

Lin Yingying1ORCID,Sena Hadi2ORCID,Frentrup Martin3ORCID,Pristovsek Markus2ORCID,Honda Yoshio2ORCID,Amano Hiroshi2ORCID

Affiliation:

1. Graduate School of Engineering, Nagoya University 1 , Chikusa-Ku, Furo-cho, Nagoya 464-8603, Japan

2. Center for Integrated Research of Future Electronics, Institute for Materials and Systems for Sustainability, Nagoya University 2 , Chikusa-Ku, Furo-cho, Nagoya 464-8603, Japan

3. Cambridge Centre for Gallium Nitride, Department of Materials Science and Metallurgy, University of Cambridge 3 , 27 Charles Babbage Road, Cambridge CB3 0FS, United Kingdom

Abstract

The stress relaxation with increasing thickness of metal-organic vapor phase epitaxy grown Al0.19Ga0.81N on quasi-bulk (101¯0) m-plane GaN substrates was investigated by x-ray diffraction. The anisotropic in-plane stress leads to an orthorhombic distortion of the lattice, which requires special mathematical treatment. Extending earlier works, we developed a method to calculate the distortion along [12¯10], [0001], and [101¯0] and obtained the lattice parameters, Al content, and strain values. The stress relaxation along the two in-plane directions involves two different mechanisms. First, the stress along [12¯10] relaxes by the onset of misfit dislocations through the {101¯0}⟨12¯10⟩ slip system while for thicker layers the stress along [0001] relaxes by crack formation. Comparing the cathodoluminescence emission at room temperature with the expected bandgap showed that both tensile in-plane strains along [12¯10] and [0001] decrease the bandgap.

Funder

China Scholarship Council

Japan Society for the Promotion of Science

Publisher

AIP Publishing

Subject

General Physics and Astronomy

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