Simulation of electrical conduction in thin polycrystalline metallic films: Impact of microstructure
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4823985
Reference17 articles.
1. Size-Dependent Resistivity in Nanoscale Interconnects
2. Surface and grain-boundary scattering in nanometric Cu films
3. Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces
4. Influence of grain boundary scattering on the electrical properties of platinum nanofilms
5. Electron grain boundary scattering and the resistivity of nanometric metallic structures
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