Low-resistance and thermally stable ohmic contact on p-type GaN using Pd/Ni metallization
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1403660
Reference10 articles.
1. Very low resistance multilayer Ohmic contact to n‐GaN
2. Investigation of the mechanism for Ohmic contact formation in Al and Ti/Al contacts ton-type GaN
3. Long-term thermal stability of Ti/Al/Pt/Au Ohmic contacts to n-type GaN
4. Study of oxygen chemisorption on the GaN(0001)‐(1×1) surface
5. Low-resistance ohmic contacts to p-type GaN
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1. Importance of layer distribution in Ni and Au based ohmic contacts to p-type GaN;Microelectronic Engineering;2023-05
2. Methods to achieve Ohmic contact to p-GaN;International Conference on Optoelectronic Materials and Devices (ICOMD 2021);2022-02-16
3. Realization of p-GaN ohmic contact by using a strained p-AlInGaN interlayer and its application in UVA LEDs;Japanese Journal of Applied Physics;2019-06-01
4. Performance Improvement of GaN Based Laser Diode Using Pd/Ni/Au Metallization Ohmic Contact;Coatings;2019-04-28
5. Investigation of Electrical and Interfacial Properties of Improved Ohmic Contact on p-Type GaN;ECS Journal of Solid State Science and Technology;2019
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