On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes-Reference-Cited by-同舟云学术

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On the relationship between SiF4 plasma species and sample properties in ultra low-k etching processes

Published:2020-06-01 Issue:6 Volume:10 Page:065212
ISSN:2158-3226
Container-title:AIP Advances
language:en
Short-container-title:AIP Advances

Author:

Haase Micha¹^ORCID,Melzer Marcel²^ORCID,Lang Norbert³^ORCID,Ecke Ramona¹,Zimmermann Sven¹²,van Helden Jean-Pierre H.³^ORCID,Schulz Stefan E.¹²

Affiliation:

1. Fraunhofer Institute for Electronic Nano Systems, Technologie-Campus 3, D-09126 Chemnitz, Germany

2. Chemnitz University of Technology, Center for Microtechnologies, D-09107 Chemnitz, Germany

3. Leibniz Institute for Plasma Science and Technology, Felix-Hausdorff-Str. 2, D-17489 Greifswald, Germany

Funder

Bundesministerium für Bildung und Forschung

Electronic Components and Systems for European Leadership

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5125498

Reference39 articles.

1. Innovative plasma diagnostics and control of process in reactive low-temperature plasmas

2. Chamber maintenance and fault detection technique for a gate etch process via self-excited electron resonance spectroscopy

3. Low Pressure Plasmas and Microstructuring Technology

4. Comprehensive understanding of chamber conditioning effects on plasma characteristics in an advanced capacitively coupled plasma etcher

5. On treatment of ultra-low-k SiCOH in CF4 plasmas: correlation between the concentration of etching products and etching rate

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1. Silicon-28-Tetrafluoride as an Educt of Isotope-Engineered Silicon Compounds and Bulk Materials for Quantum Systems;Molecules;2024-09-05

2. Model-Based XPS Technique for Characterization of Surface Composition on Nano-Scale SiCOH Sidewalls;ECS Journal of Solid State Science and Technology;2023-12-01

3. A simple analytical model to describe time-resolved concentrations of plasma species;2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM);2023-05

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